| Electronic Components Datasheet Search |
|
PCIMX258CJM4A Datasheet(PDF) 18 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
PCIMX258CJM4A Datasheet(HTML) 18 Page - Freescale Semiconductor, Inc |
|
18 / 144 page ![]() i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 3 18 Freescale Semiconductor The method for obtaining the maximum current is as follows: 1. Measure the worst case power consumption on individual rails using directed test on i.MX25. 2. Correlate the worst case power consumption power measurements with the worst case power consumption simulations. 3. Combine common voltage rails based on the power supply sequencing requirements (add the worst case power consumption on each rail within some test cases from several test cases run, to maximize different rails in the power group). 4. Guard the worst case numbers for temperature and process variation. 5. The sum of individual rails is greater than the real world power consumption, since a real system does not typically maximize the power consumption on all peripherals simultaneously. 6. BATT_VDD current is measured when the system is in reduced power mode maintaining the RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current becomes negligible. Refer to Table 10, for more details on the power modes. NOTE The values mentioned above should not be taken as a typical max run data for specific use cases. These values are Absolute MAX data. Freescale recommends that the system current measurements are taken with customer-specific use-cases to reflect normal operating conditions in the end system 3.4 Thermal Characteristics The thermal resistance characteristics for the device are given in Table 14. These values are measured under the following conditions: • Two-layer substrate • Substrate solder mask thickness: 0.025 mm • Substrate metal thicknesses: 0.016 mm • Substrate core thickness: 0.200 mm • Core via I.D: 0.118 mm, Core via plating 0.016 mm. • Flag: Trace style with ground balls under the die connected to the flag • Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K • Mold compound: Generic mold compound; k = 0.9 W/m K FUSE_VDD1 3.6 62 BATT_VDD 1.55 0.030 1 The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed. Table 13. Power Consumption (continued) Power Supply Voltage (V) Max Current (mA) |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |