PIC16C72-04SLASHSP datasheet(79/124 Pages) MICROCHIP

79 / 124 page

PIC16C72 Series

Preliminary

DS39016A-page 79

13.1

DC Characteristics:

PIC16C72/CR72-04 (Commercial, Industrial, Extended)

PIC16C72/CR72-10 (Commercial, Industrial, Extended)

PIC16C72/CR72-20 (Commercial, Industrial, Extended)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40˚C

≤ TA ≤ +125˚C for extended,

-40˚C

≤ TA ≤ +85˚C for industrial and

0˚C

≤ TA ≤ +70˚C for commercial

Param

No.

Characteristic

Sym

PIC16C72

PIC16CR72

Units

Conditions

Min

Typ†

Max

Min

Typ†

Max

D001

D001A

Supply Voltage

VDD

4.0

4.5

6.0

5.5

4.0

4.5

5.5

XT, RC and LP osc

HS osc

D002*

RAM Data Retention

Voltage (Note 1)

VDR

1.5

D003

VDD start voltage to

ensure internal Power-

on Reset Signal

VPOR

VSS

See section on Power-

on Reset for details

D004*

VDD rise rate to ensure

internal Power-on

Reset Signal

SVDD

0.05

V/ms

See section on Power-

on Reset for details

D005

Brown-out Reset Volt-

age

Bvdd

3.7

4.0

4.3

3.7

4.0

4.3

BODEN bit in conﬁgura-

tion word enabled

3.7

4.0

4.4

3.7

4.0

4.4

Extended Only

D010

Supply Current

(Note 2,5)

IDD

2.7

5.0

2.7

5.0

XT, RC osc

FOSC = 4 MHz,

VDD = 5.5V (Note 4)

D013

HS osc

FOSC = 20 MHz,

VDD = 5.5V

D015

Brown-out Reset

Current (Note 6)

∆Ibor

350

425

350

425

µA

BOR enabled,

VDD = 5.0V

D020

Power-down Current

(Note 3,5)

IPD

10.5

µA

VDD = 4.0V, WDT

enabled, -40

°C to +85°C

D021

1.5

µA

VDD = 4.0V, WDT dis-

abled, -0

°C to +70°C

D021A

1.5

µA

VDD = 4.0V, WDT dis-

abled, -40

°C to +85°C

D021B

2.5

µA

VDD = 4.0V, WDT dis-

abled, -40

°C to +125°C

D023

Brown-out Reset

Current (Note 6)

∆Ibor

350

425

350

425

µA

BOR enabled VDD =

5.0V

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1:

This is the limit to which VDD can be lowered without losing RAM data.

Note 2:

The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-

sumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as speciﬁed.

Note 3:

The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with

the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

Note 4:

For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be estimated by the

formula Ir = VDD/2Rext (mA) with Rext in kOhm.

Note 5:

Timer1 oscillator (when enabled) adds approximately 20

µA to the speciﬁcation. This value is from characterization and

is for design guidance only. This is not tested.

Note 6:

The

∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the

base IDD or IPD measurement.

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