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LIS2DS12 Datasheet(PDF) 64 Page - STMicroelectronics |
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LIS2DS12 Datasheet(HTML) 64 Page - STMicroelectronics |
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64 / 68 page ![]() Package information LIS2DS12 64/68 DocID027753 Rev 4 11 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 11.1 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com. 11.2 LGA-12 package information Figure 20. LGA-12 2x2x0.86 mm package outline and mechanical data |
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