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TMP320C2811PBKA Datasheet(PDF) 144 Page - Texas Instruments |
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TMP320C2811PBKA Datasheet(HTML) 144 Page - Texas Instruments |
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144 / 147 page ![]() Mechanical Data 144 June 2004 SPRS257 8 Mechanical Data 8.1 Ball Grid Array (BGA) GHH (S-PBGA-N179) PLASTIC BALL GRID ARRAY 0,08 0,10 1,40 MAX 0,85 0,55 0,45 0,45 0,35 0,95 11,90 12,10 SQ 4173504−3/C 12/01 Seating Plane 7 B A 2 1 C D F E G 4 3 6 5 N K H J L M P 9 8 11 10 13 12 14 0,40 10,40 TYP A1 Corner Bottom View 0,80 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice C. MicroStar BGA configuration. D. This package is not lead-free and needs a minimum reflow temperature of 220°C but not exceeding 235°C. Figure 7−1. TMS320R2812 179-Ball GHH MicroStar BGA Table 7−1. Thermal Resistance Characteristics for 179-GHH PARAMETER 179-GHH PACKAGE UNIT PsiJT 0.658 °C/W ΘJA 42.57 °C/W ΘJC 16.08 °C/W MicroStar BGA is a trademark of Texas Instruments. |
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