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TMP320C2811PBKA Datasheet(PDF) 145 Page - Texas Instruments |
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TMP320C2811PBKA Datasheet(HTML) 145 Page - Texas Instruments |
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145 / 147 page ![]() Mechanical Data 145 June 2004 SPRS257 8.2 Plastic Ball Grid Array ZHH (S−PBGA−N179) PLASTIC BALL GRID ARRAY 1,40 MAX 0,85 0,55 0,45 0,45 0,35 0,95 11,90 12,10 SQ 4204739/A 10/02 Seating Plane 7 B A 2 1 C D F E G 4 3 6 5 N K H J L M P 9 8 11 10 13 12 14 0,40 10,40 TYP 0,40 A1 Corner 0,10 0,08 Bottom View 0,80 0,80 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGAt configuration. D. This package is lead-free and needs a minimum reflow temperature of 250°C but not exceeding 260°C. Figure 7−2. TMS320R2812 179-Ball ZHH MicroStar BGA Table 7−2. Thermal Resistance Characteristics for 179-ZHH PARAMETER 179-ZHH PACKAGE UNIT PsiJT 0.658 °C/W ΘJA 42.57 °C/W ΘJC 16.08 °C/W MicroStar BGA is a trademark of Texas Instruments. |
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