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DP83848JSQ/NOPB Datasheet(PDF) 81 Page - Texas Instruments |
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DP83848JSQ/NOPB Datasheet(HTML) 81 Page - Texas Instruments |
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81 / 84 page  www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 40X 0.3 0.2 4.6 0.1 40X 0.5 0.3 0.8 MAX (0.1) TYP 0.05 0.00 36X 0.5 4X 4.5 A 6.1 5.9 B 6.1 5.9 0.5 0.3 0.3 0.2 WQFN - 0.8 mm max height RTA0040A PLASTIC QUAD FLATPACK - NO LEAD 4214989/A 12/2014 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 10 21 30 11 20 40 31 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.200 DETAIL OPTIONAL TERMINAL TYPICAL |
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