DP83848JSQSLASHNOPB datasheet(10/84 Pages) TI1

10 / 84 page

DP83848H, DP83848J, DP83848K, DP83848M, DP83848T

SNLS250E – MAY 2008 – REVISED APRIL 2015

www.ti.com

Specifications

5.1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

4.2

VIN

DC input voltage

–0.5

VCC + 0.5

VOUT

DC output voltage

–0.5

VCC + 0.5

Max case temperature

147.7

°C

Max die temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All parameters are specified by test, statistical analysis or design.

5.2

ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±4000

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-

±1000

C101(3)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

RZAP = 1.5 kΩ, CZAP = 120 pF

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3.3

±0.3

Commerical - DP83848J/M

°C

Ambient temperature

Industrial - DP83848K/T

–40

Extreme - DP83848H

–40

125

Power dissipation

264

5.4

Thermal Information

DP83848x

THERMAL METRIC(1)

RTA [WQFN]

UNIT

40 PINS

RθJA

Junction-to-ambient thermal resistance

31.7

RθJC(top)

Junction-to-case (top) thermal resistance

8.8

RθJB

Junction-to-board thermal resistance

40.5

°C/W

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

10.5

RθJC(bot)

Junction-to-case (bottom) thermal resistance

5.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Specifications

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