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ZAMC4100GA2R Datasheet(PDF) 148 Page - Renesas Technology Corp |
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ZAMC4100GA2R Datasheet(HTML) 148 Page - Renesas Technology Corp |
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148 / 156 page ![]() ZAMC4100 Datasheet © 2016 Integrated Device Technology, Inc. 148 January 26, 2016 7 Multi-chip Module Assembly, Pin Layout, and Pin Assignments ZAMC4100 is a highly integrated solution consisting of Microcontroller Unit (MCU) and System Basis Chip (SBC) within a single plastic QFN package as shown below. Both chips are assembled in a multi-chip-package placed horizontally alongside one another. The exposed pad allows better thermal performance. Figure 7.2 gives the pin layout and assignments. See Table 7.1 for the description of the pins. Figure 7.1 ZAMC4100 Multi-chip-Module Assembly SBC MCU Off-chip bonding wires External pin bonding wires Exposed pad Figure 7.2 Pin Layout for ZAMC4100 PQFN65 – Top View EXPOSED PAD (pin 65) 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 TCK TMS TDO TDI GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 n.c. CAP_3V3 CAP_1V8 HB2a VSS3 HB1b VDDE2 VDDE3 HS1a VDDE4 VDDE5 HS2 HS1b VDDE6 VDDE7 HB1a HS3 VSS2 HB2b CAP_MCU |
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