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HC705E5GRS/D Datasheet(PDF) 135 Page - NXP Semiconductors |
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HC705E5GRS/D Datasheet(HTML) 135 Page - NXP Semiconductors |
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135 / 148 page ![]() Electrical Specifications Operating Temperature Range MC68HC705E5 — Rev. 1.0 General Release Specification Electrical Specifications 15.4 Operating Temperature Range 15.5 Thermal Characteristics Characteristic Symbol Value Unit Operating Temperature Range MC68HC(7)05E5DW (Standard) MC68HC(7)05E5P T A T L to TH 0 to +70 0 to +70 °C Characteristic Symbol Value Unit Thermal Resistance Plastic DIP SOIC θ JA 60 60 °C/W I/O Pin Power Dissipation PI/O User Determined W Power Dissipation(1) PD PD = (IDD x VDD) + PI/O = K/(TJ + 273 °C) W Constant(2) K PD x(TA + 273 °C) + PD 2 x θ JA W/ °C Average Junction Temperature TJ TA + (PD x θJA) °C Maximum Junction Temperature TJM 125 °C NOTES: 1. Power dissipation is a function of temperature. 2. K is a constant unique to the device. K can be determined for a known TA and measured PD. With this value of K, PD and TJ can be determined for any value of TA. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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