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STM32F103XC Datasheet(PDF) 108 Page - STMicroelectronics |
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STM32F103XC Datasheet(HTML) 108 Page - STMicroelectronics |
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108 / 118 page ![]() Package characteristics STM32F103xC, STM32F103xD, STM32F103xE 108/118 Figure 57. LFBGA100 - low profile fine pitch ball grid array package outline Table 64. LFBGA100 - low profile fine pitch ball grid array package mechanical data Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 1.700 0.0026 A1 0.270 0.0004 A2 1.085 0.0017 A3 0.30 0.0005 A4 0.80 0.0012 b 0.45 0.50 0.55 0.0007 0.0008 0.0009 D 9.85 10.00 10.15 0.0153 0.0155 0.0157 D1 7.20 0.0111 E 9.85 10.00 10.15 0.0153 0.0155 0.0157 E1 7.20 0.0111 e 0.80 0.0012 F 1.40 0.0022 ddd 0.12 0.0002 eee 0.15 0.0002 fff 0.08 0.0001 N (number of balls) 100 ai14396 A2 A4 A3 A1 A Seating plane B A1 corner index area (see note 5) (100 balls) Bottom view 123456789 10 F E1 E e A D D1 e F K J H G F E D C B A ddd C C eee fff CA B C M M ∅ ∅ b ∅ |
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