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PCIMX258CJM4A Datasheet(PDF) 124 Page - Freescale Semiconductor, Inc |
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PCIMX258CJM4A Datasheet(HTML) 124 Page - Freescale Semiconductor, Inc |
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124 / 144 page  i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 3 124 Freescale Semiconductor • Maximum solder bump diameter measured parallel to datum A. • Datum A, the seating plane, is determined by the spherical crowns of the solder bumps. • Parallelism measurement shall exclude any effect of mark on top surface of package. Figure 98. 17x17 i.MX25 Production Package 4.2 Ground, Power, Sense, and Reference Contact Assignments Case 17x17 mm, 0.8 mm Pitch Table 98 shows the 17 ×17 mm package ground, power, sense, and reference contact assignments. Table 98. 17x17 mm Package Ground, Power Sense, and Reference Contact Assignments Contact Name Contact Assignment BATT_VDD P10 FUSE_VDD T17 MPLL_GND U17 MPLL_VDD U18 NGND_ADC Y13 NVCC_ADC W13 |
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