LM98714CCMTSLASHNOPB datasheet(7/114 Pages) TI1

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AGND

To Internal Circuitry

I/O

LM98714

www.ti.com

SNAS254A – OCTOBER 2006 – REVISED JANUARY 2014

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Supply Voltage (VA,VR,VD,VC)

4.2 V

Voltage on Any Input Pin (Not to exceed 4.2 V)(3)

−0.3 V to (VA + 0.3 V)

Voltage on Any Output Pin (execpt DVB and not to exceed 4.2 V)

−0.3 V to (VA + 0.3 V)

DVB Output Pin Voltage

2.0V

Input Current at any pin other than Supply Pins(4)

±25 mA

Package Input Current (except Supply Pins) (4)

±50 mA

Maximum Junction Temperature (TA)

150°C

Thermal Resistance (

θJA)

66°C/W

Package Dissipation at TA = 25°C

(5)

1.89 W

Human Body Model

2500 V

ESD Rating(6)

Machine Model

250 V

Storage Temperature

−65°C to +150°C

Soldering process must comply with Texas Instruments’ Reflow Temperature Profile specifications. Refer to www.ti.com/packaging (7)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Operating Ratings is not

recommended.

(2)

All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.

(3)

The analog inputs are protected as shown below. Input voltage magnitudes beyond the supply rails will not damage the device, provided

the current is limited per note 3. However, input errors will be generated If the input goes above VA and below AGND.

(4)

When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be

limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the

power supplies with an input current of 25 mA to two.

(5)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature,

TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX – TA)/θJA. The values for maximum power dissipation

listed above will be reached only when the device is operated in a severe fault condition (for example, when input or output pins are

driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.

(6)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through 0 Ω.

(7)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

Operating Ratings

(1) (2)

Operating Temperature Range

0°C

≤ TA ≤ +70°C

All Supply Voltage

+3.0 V to +3.6 V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Operating Ratings is not

recommended.

(2)

All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.

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