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MSP430F14X Datasheet(PDF) 16 Page - Texas Instruments |
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MSP430F14X Datasheet(HTML) 16 Page - Texas Instruments |
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16 / 83 page  16 MSP430F149, MSP430F148, MSP430F147 MSP430F1491, MSP430F1481, MSP430F1471 MSP430F135, MSP430F133 SLAS272H – JULY 2000 – REVISED MAY 2018 www.ti.com Submit Documentation Feedback Product Folder Links: MSP430F149 MSP430F148 MSP430F147 MSP430F1491 MSP430F1481 MSP430F1471 MSP430F135 MSP430F133 Specifications Copyright © 2000–2018, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to VSS, unless otherwise noted. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to the TDI/TCLK pin when blowing the JTAG fuse. 5 Specifications 5.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Voltage applied at VCC to VSS −0.3 4.1 V Voltage applied to any pin (2) −0.3 VCC + 0.3 V Diode current at any device terminal ±2 mA Storage temperature Programmed device −40 85 °C Unprogrammed device –55 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±1000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V may actually have higher performance. 5.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge ratings Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250 (1) In LF mode, the LFXT1 oscillator requires a watch crystal. TI recommends a 5.1-MΩ resistor from XOUT to VSS when VCC < 2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15 MHz at VCC ≥ 2.2 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8 MHz at VCC ≥ 2.8 V. 5.3 Recommended Operating Conditions Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage (AVCC = DVCC = VCC) During program execution 1.8 3.6 V During flash memory programming 2.7 3.6 VSS Supply voltage (AVSS = DVSS = VSS) 0 0 V TA Operating free-air temperature –40 85 °C fLFXT1 LFXT1 crystal frequency(1) LF selected, XTS = 0, watch crystal 32768 Hz XT1 selected, XTS = 1, ceramic resonator 450 8000 kHz XT1 selected, XTS = 1, crystal 1000 8000 fXT2 XT2 crystal frequency(1) Ceramic resonator 450 8000 kHz Crystal 1000 8000 fSYSTEM Processor frequency (signal MCLK) VCC = 1.8 V DC 4.15 MHz VCC = 3.6 V DC 8 |
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