TDA8006HSLASHC2 datasheet(30/40 Pages) PHILIPS

30 / 40 page

2000 Feb 21

Philips Semiconductors

Product speciﬁcation

Multiprotocol IC Card coupler

TDA8006

Card supply voltage (pin VCC); note 3

VO(VCC)

card supply output voltage

inactive

no load

−

0.1

IO(VCC) =1mA

−

0.3

pin grounded

−−1mA

active

ICC < 65 mA; 5 V card

4.75

5.25

ICC < 65 mA; 3 V card

2.8

3.2

current pulses of 40 nAs with

ICC < 200 mA; t < 400 ns;

f < 20 MHz; 5 V card

4.6

−

5.4

current pulses of 24 nAs with

ICC < 200 mA; t < 400 ns;

f < 20 MHz; 3 V card

2.75

−

3.25

IO(VCC)

card supply output current

from 0 to 3 or 5 V

−−

VCC short circuited to GND

−−

250

ICC(sd)

shutdown current at pin VCC

−−80

−

slew rate

up or down

(capacitor = 100 to 300 nF)

0.10

0.16

0.22

µs

Data line (pin I/O); note 4

Vo(I/O)

output voltage

inactive

no load

−

0.1

Io(I/O) =1mA

−−

0.3

Io(I/O)

output current

inactive and pin grounded

−−1mA

VOL

LOW-level output voltage

I/O conﬁgured as output;

IOL =1mA

−

0.3

VOH

HIGH-level output voltage

I/O conﬁgured as output;

IOH < −50 µA

0.8VCC

−

VCC + 0.25 V

VIL

LOW-level input voltage

I/O conﬁgured as input

−0.3

−

+0.8

VIH

HIGH-level input voltage

I/O conﬁgured as input

1.5

−

VCC

IIL

LOW-level input current

VIL =0 V

−−

−600

µA

ILIH

HIGH-level input leakage

current

VIH =VCC

−−

µA

ti(r)

input rise time

CL =30pF

−−

µs

ti(f)

input fall time

CL =30pF

−−

µs

to(r)

output rise time

CL =30pF

−−

0.1

µs

to(f)

output fall time

CL =30pF

−−

0.1

µs

Rpu(int)

internal pull-up resistance

between I/O and VCC

810

Ω

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

TDA8006H/C2 Datasheet(PDF) 30 Page - NXP Semiconductors

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