2000 Feb 21

32

Philips Semiconductors

Product specification

Multiprotocol IC Card coupler

TDA8006

Notes

2. Values given for program executed from internal ROM. Current consumption may be higher if program is executed

from external ROM or if charges are present on I/O ports.

3. A ceramic multilayer capacitor having a minimum value of 100 nF with a low ESR should be used to obtain these

specifications.

4. The I/O line has an integrated 10 k

5. Pins C4 and C8 have integrated 10 k

OPTIONS

Table 12 Options

Card presence input (pin PRES)

LOW-level input voltage

−−

V

HIGH-level input voltage

−−

V

LOW-level input leakage

current

−−

20

µA

HIGH-level input leakage

current

−−

20

µA

FEATURES

OPTIONS

Alarm

active HIGH

active LOW

Presence

active HIGH

active LOW

MOVEC protection

on

off

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT