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MFS2301BMBACEP Datasheet(PDF) 17 Page - NXP Semiconductors

Part # MFS2301BMBACEP
Description  Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers
PDF  230 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MFS2301BMBACEP Datasheet(HTML) 17 Page - NXP Semiconductors

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NXP Semiconductors
FS23
Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers
10 Thermal characteristics
Symbol
Description (Rating)
Min
Max
Unit
Thermal ratings
TA
Ambient temperature (Grade 1)
–40
125
°C
TJ
Junction temperature (Grade 1)
–40
150
°C
TSTG
Storage temperature
–55
150
°C
Thermal resistance (per JEDEC JESD51-2 and JESD51-8)
RθJA[1]
Thermal resistance junction to ambient (2s2p)
-
28.5
°C/W
RθJC_BOT[2]
Thermal resistance junction to case bottom
(between the die and the solder pad on the bottom of the package)
-
2.3
°C/W
RθJC_TOP[3]
Thermal resistance junction to case top
(between package top and the junction temperature)
-
19.1
°C/W
ΨJT[1]
Thermal characterization parameter Junction to Top of package
-
0.3
°C/W
Table 7. Thermal characteristics
[1]
Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal
performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an
application-specific environment.
[2]
Junction-to-Case Bottom thermal resistance determined using an isothermal cold plate. Case temperature refers to the exposed pad surface temperature
at the package bottom side dead center.
[3]
Junction-to-Case Top thermal resistance determined using an isothermal cold plate. Case temperature refers to the mold surface temperature at the
package top side dead center.
FS23
All information provided in this document is subject to legal disclaimers.
© 2024 NXP B.V. All rights reserved.
Product data sheet
Rev. 7.0 — 16 October 2024
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