TSC2004 datasheet(5/62 Pages) TI2

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PIN CONFIGURATIONS

SNSGND

AD0

TSC2004

ThermalPad

AGND

AUX

I/OVDD

DGND

Columns

(FRONT

VIEW)

AD1

SNSGND

DGND

I/OVDD

SUBGND

AUX

X+

VREF

Y+

SNSVDD

AGND

SDA

PINTDAV

AD0

SCL

RESET

TSC2004

SBAS408E – JUNE 2007 – REVISED MARCH 2008

RTJ PACKAGE(1)

YZK PACKAGE

QFN-20

WCSP-18

(TOP VIEW)

(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)

(1)

The thermal pad is internally connected to

SUBGND.

The

thermal

pad

can

connected to the analog ground or left

floating. Keep the thermal pad separate

from the digital ground, if possible.

PIN ASSIGNMENTS

PIN NO.

QFN

WCSP

NAME

I/O

A/D

DESCRIPTION

SDA

I/O

Serial data I/O

SCL

Serial clock.

AD1

Address input bit 1

PINTDAV

Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low.

RESET

System reset. All register values reset to default values.

DGND

Digital ground

I/OVDD

Digital I/O interface voltage

B3, B4,

No internal connection, but solder bumps are populated. These pins may be connected to analog ground

8, 19

C2, C3,

for mechanical stability.

D2, D3

AUX

Auxiliary channel input

AGND

Analog ground

VREF

External reference input

SNSVDD

Power supply for sensor drivers and other analog blocks.

X+

X+ channel input

Y+

Y+ channel input

SUBGND

Substrate ground (for ESD current). Connection to AGND (on the PCB) is recommended.

X–

X– channel input

Y–

Y– channel input

SNSGND

Sensor driver return

AD0

Address input bit 0

—

No solder bump for this location.

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