ADSP-21469KBZ-ENG2 datasheet(51/56 Pages) AD

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ADSP-21469/ADSP-21469W

Preliminary Technical Data

Rev. PrB

Page 51 of 56

November 2008

THERMAL CHARACTERISTICS

The ADSP-21469 processor is rated for performance over the

temperature range specified in Operating Conditions on

Page 16.

Table 47 airflow measurements comply with JEDEC standards

JESD51-2 and JESD51-6 and the junction-to-board measure-

ment complies with JESD51-8. Test board design complies with

JEDEC standards JESD51-7 (PBGA). The junction-to-case mea-

surement complies with MIL- STD-883. All measurements use a

2S2P JEDEC test board.

To determine the junction temperature of the device while on

the application PCB, use:

where:

TJ = junction temperature °C

TCASE = case temperature (°C) measured at the top center of the

package

ΨJT = junction-to-top (of package) characterization parameter

is the Typical value from Table 47.

PD = power dissipation

Values of

θJA are provided for package comparison and PCB

design considerations.

θJA can be used for a first order approxi-

mation of TJ by the equation:

where:

TA = ambient temperature °C

Values of

θJC are provided for package comparison and PCB

design considerations when an external heatsink is required.

Values of

θJB are provided for package comparison and PCB

design considerations. Note that the thermal characteristics val-

ues provided in Table 47 are modeled values.

Figure 44. Typical Output Delay or Hold vs. Load Capacitance

(at Ambient Temperature)

100

250

200

150

TBD

CASE

()

Table 47. Thermal Characteristics for 324-Lead PBGA

Parameter

Condition

Typical

Unit

θJA

Airflow = 0 m/s

TBD

°C/W

θJMA

Airflow = 1 m/s

TBD

°C/W

θJMA

Airflow = 2 m/s

TBD

°C/W

θJC

TBD

°C/W

ΨJT

Airflow = 0 m/s

TBD

°C/W

ΨJMT

Airflow = 1 m/s

TBD

°C/W

ΨJMT

Airflow = 2 m/s

TBD

°C/W

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