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PIC16F676-E/ST Datasheet(PDF) 117 Page - Microchip Technology |
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PIC16F676-E/ST Datasheet(HTML) 117 Page - Microchip Technology |
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117 / 132 page  2010 Microchip Technology Inc. DS40039F-page 117 PIC16F630/676 14.0 PACKAGING INFORMATION 14.1 Package Marking Information XXXXXXXXXXXXXX 14-Lead PDIP (Skinny DIP) Example XXXXXXXXXXXXXX YYWWNNN 16F630-I 1015/017 XXXXXXXXXXX 14-Lead SOIC XXXXXXXXXXX YYWWNNN Example 16F630-E 1015/017 14-Lead TSSOP NNN XXXXXXXX YYWW Example 017 16F630 1015 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note : In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e |
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