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PM6652 Datasheet(PDF) 50 Page - STMicroelectronics |
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PM6652 Datasheet(HTML) 50 Page - STMicroelectronics |
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50 / 53 page  Package mechanical data PM6652 50/53 Doc ID 16867 Rev 5 11 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Note: VFQFPN stands for thermally enhanced very thin fine pitch quad flat package no lead. Very thin: A = 1.00 mm max. Table 9. VFQFPN 5x5x1.0 mm 32L pitch 0.50 mechanical data Dim. (mm) Min. Typ. Max. A 0.80 0.90 1.00 A1 0 0.02 0.05 A3 0.20 b 0.18 0.25 0.30 D 4.85 5.00 5.15 D2 (1) 1. Dimensions D2 and E2 are not in accordance with JEDEC. 2.90 3.10 3.20 E 4.85 5.00 5.15 E2 (2) 2.90 3.10 3.20 e0.50 L 0.30 0.40 0.50 ddd 0.05 |
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