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CC3220MODASM2MONR Datasheet(PDF) 76 Page - Texas Instruments |
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CC3220MODASM2MONR Datasheet(HTML) 76 Page - Texas Instruments |
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76 / 100 page ![]() 76 CC3220MOD, CC3220MODA SWRS206B – MARCH 2017 – REVISED AUGUST 2017 www.ti.com Submit Documentation Feedback Product Folder Links: CC3220MOD CC3220MODA Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated 7.3 PCB Layout Guidelines This section details the PCB guidelines to speed up the PCB design using the CC3220MODx and CC3220MODAx modules. The integrator of the CC3220MODx and CC3220MODAx modules must comply with the PCB layout recommendations described in the following subsections to minimize the risk with regulatory certifications for the FCC, IC, CE, MIC, and SRRC. Moreover, TI recommends customers follow the guidelines described in this section to achieve similar performance to that obtained with the TI reference design. 7.3.1 General Layout Recommendations Ensure that the following general layout recommendations are followed: • Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted. 7.3.2 CC3220MODx RF Layout Recommendations The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations. Figure 7-2 shows the RF placement and routing of the CC3220MODx module with external antenna. Figure 7-2. RF Section Layout Follow these RF layout recommendations for the CC320MODx device: • RF traces must have 50-Ω impedance. • RF trace bends must be made with gradual curves, and 90° bends must be avoided. • RF traces must not have sharp corners. • There must be no traces or ground under the antenna section. • RF traces must have via stitching on the ground plane beside the RF trace on both sides. • RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. |
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