MB90351ASPMC1 datasheet(79/83 Pages) CYPRESS

79 / 83 page

Document Number: 002-07872 Rev. *A

Page 79 of 83

MB90350 Series

17. Package Dimensions

(Continued)

64-pin plastic LQFP

Lead pitch

0.65 mm

Package width

package length

12.0

× 12.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.47 g

Code

(Reference)

P-LQFP64-12

×12-0.65

64-pin plastic LQFP

(FPT-64P-M23)

2003-2010 FUJITSU SEMICONDUCTOR LIMITED F64034S-c-1-4

0.65(.026)

0.10(.004)

*12.00±0.10(.472±.004)SQ

14.00±0.20(.551±.008)SQ

INDEX

0.32±0.05

(.013±.002)

0.13(.005)

0.145±0.055

(.006±.002)

"A"

.059 –.004

+.008

–0.10

+0.20

1.50

0~8°

0.25(.010)

(Mounting height)

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.10±0.10

(.004±.004)

Details of "A" part

(Stand off)

Dimensions in mm (inches).

Note: The values in parentheses are reference values

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3)Pins width do not include tie bar cutting remainder.

MB90351ASPMC1 Datasheet(PDF) 79 Page - Cypress Semiconductor

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