MB90351ASPMC1 datasheet(80/83 Pages) CYPRESS

80 / 83 page

Document Number: 002-07872 Rev. *A

Page 80 of 83

MB90350 Series

(Continued)

64-pin plastic LQFP

Lead pitch

0.50 mm

Package width

package length

10.0 mm

× 10.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Code

(Reference)

P-LFQFP64-10

×10-0.50

64-pin plastic LQFP

(FPT-64P-M24)

LEAD No.

"B"

0.08(.003)

(.006±.002)

0.145±0.055

0.08(.003) M

(.008±.002)

0.20±0.05

0.50(.020)

12.00±0.20(.472±.008)SQ

*10.00±0.10(.394±.004)SQ

INDEX

2006-2010 FUJITSU SEMICONDUCTOR LIMITED F64036S-1c(D)-1-3

"A"

NOM.

11.00(.433)

0.15(.006)

MAX

0.40(.016)

Details of "A" part

(Stand off)

Details of "B" part

(.004±.004)

0.10±0.10

(.024±.006)

0.60±0.15

(.020±.008)

0.50±0.20

(Mounting height)

0.25(.010)

.059 –.004

+.008

–

0.10

+0.20

1.50

0~8°

Dimensions in mm (inches).

Note: The values in parentheses are reference values

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3)Pins width do not include tie bar cutting remainder.

MB90351ASPMC1 Datasheet(PDF) 80 Page - Cypress Semiconductor

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