TMPR4955AF datasheet(33/168 Pages) TOSHIBA

33 / 168 page

General Safety Precautions and Usage Considerations

3-13

(1) Using a soldering iron

Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three

seconds for lead temperatures of up to 350°C.

(2) Using medium infrared ray reflow

• Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).

Long infrared ray heater (preheating)

Medium infrared ray heater

(reflow)

Product flow

Figure 3

Heating top and bottom with long or medium infrared rays

• Complete the infrared ray reflow process within 30 seconds at a package surface temperature of

between 210°C and 240°C.

• Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.

210

30 s

or less

Time (s)

60-120 s

(°C)

240

160

140

Figure 4

Sample temperature profile for infrared or hot air reflow

(3) Using hot air reflow

• Complete hot air reflow within 30 seconds at a package surface temperature of between 210°C

and 240°C.

• For an example of a recommended temperature profile, refer to Figure 4 above.

(4) Using solder flow

• Apply preheating for 60 to 120 seconds at a temperature of 150°C.

• For lead insertion-type packages, complete solder flow within 10 seconds with the

temperature at the stopper (or, if there is no stopper, at a location more than 1.5 mm from

the body) which does not exceed 260°C.

TMPR4955AF Datasheet(PDF) 33 Page - Toshiba Semiconductor