TAS2020 datasheet(5/79 Pages) TI2

5 / 79 page

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply Voltage

PVDD

–0.3

Supply Voltage

VDD

–0.3

Supply Voltage

IOVDD

–0.3

Class-D Output

OUTP, OUTM

–0.7

High Side Drive Regulator

GREG

–0.3 PVDD + 6

Digital Supply Regulator

DREG

–0.3

1.65

Digital IO Pins

Digital pins referenced to IOVDD supply

–0.3

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VPVDD

Amplifier Supply

2.5

5.5

VVDD

Supply Voltage

1.65

1.8

1.95

VIOVDD

IO Supply Voltage 1.8V

1.62

1.8

1.98

VIOVDD

IO Supply Voltage 3.3V

3.0

3.3

3.6

RSPK

Speaker resistance

3.2

38.4

LSPK

Speaker inductance

100

µH

Ambient temperature

–40

°C

Junction temperature

–40

150

°C

5.4 Thermal Information

THERMAL METRIC(1)

Standard JEDEC(2)

UNIT

HR-QFN

26 PINS

RθJA

Junction-to-ambient thermal resistance

51.5

℃/W

RθJC(top)

Junction-to-case (top) thermal resistance

28.5

℃/W

RθJB

Junction-to-board thermal resistance

15.3

℃/W

ΨJT

Junction-to-top characterization parameter

0.9

℃/W

www.ti.com

TAS2020

SLASFD4A – AUGUST 2024 – REVISED JULY 2026

Submit Document Feedback

Product Folder Links: TAS2020

TAS2020 Datasheet(PDF) 5 Page - Texas Instruments

TAS2020 Datasheet(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79

Datasheet Download

Link URL