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STM8S105C4B3 Datasheet(PDF) 115 Page - STMicroelectronics

Part # STM8S105C4B3
Description  Access line, 16 MHz STM8S 8-bit MCU, up to 32 Kbytes Flash, integrated EEPROM,10-bit ADC, timers, UART, SPI, I²C
PDF  127 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8S105C4B3 Datasheet(HTML) 115 Page - STMicroelectronics

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 115 / 127 page
background image
inches
(1)
mm
Dim.
Max
Typ
Min
Max
Typ
Min
0.0700
1.778
e
0.4000
10.160
eA
0.5000
12.700
eB
0.1500
0.1200
0.1000
3.810
3.048
2.540
L
(1) Values in inches are converted from mm and rounded to 4 decimal digits
Thermal characteristics
11.3
The maximum chip junction temperature (TJ max) must never exceed the values given in
Operating conditions
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using
the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
• TAmax is the maximum ambient temperature in °C
• ΘJA is the package junction-to-ambient thermal resistance in ° C/W
• PDmax is the sum of PINTmax and PI/Omax(PDmax = PINTmax + PI/Omax)
• PINTmax is the product of IDDandVDD, expressed in Watts. This is the maximum chip internal
power.
• PI/OmaxrepresentsthemaximumpowerdissipationonoutputpinsWhere:PI/Omax=Σ(VOL*IOL)
+ Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low
and high level in the application.
Table 58: Thermal characteristics
(1)
Unit
Value
Parameter
Symbol
°C/W
57
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
ΘJA
°C/W
54
Thermal resistance junction-ambient
LQFP 44 - 10 x 10 mm
ΘJA
115/127
DocID14771 Rev 9
Package characteristics
STM8S105xx



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