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TMS320DM814X Datasheet(PDF) 295 Page - Texas Instruments

Part # TMS320DM814X
Description  DaVinci Video Processors
PDF  377 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMS320DM814X Datasheet(HTML) 295 Page - Texas Instruments

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TMS320DM8148, TMS320DM8147
www.ti.com
SPRS647E – MARCH 2011 – REVISED DECEMBER 2013
Complete stackup specifications are provided in Table 8-56.
Table 8-56. PCB Stackup Specifications
NO.
PARAMETER
MIN
TYP
MAX
UNIT
1
PCB routing/plane layers
6
2
Signal routing layers
3
3
Full ground layers under DDR2 routing region
2
4
Number of ground plane cuts allowed within DDR routing region
0
5
Number of ground reference planes required for each DDR2 routing layer
1
6
Number of layers between DDR2 routing layer and reference ground plane
0
7
PCB routing feature size
4
Mils
8
PCB trace width, w
4
Mils
9
PCB BGA escape via pad size(1)
18
20
Mils
10
PCB BGA escape via hole size(1)
10
Mils
11
Processor BGA pad size
0.4
mm
13
Single-ended impedance, Zo
50
75
Ω
14
Impedance control(2)
Z-5
Z
Z+5
Ω
(1)
A 20/10 via may be used if enough power routing resources are available. An 18/10 via allows for more flexible power routing to the
processor.
(2)
Z is the nominal singled-ended impedance selected for the PCB specified by item 13.
Copyright © 2011–2013, Texas Instruments Incorporated
Peripheral Information and Timings
295
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Product Folder Links: TMS320DM8148 TMS320DM8147



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