MPF5023AMBA0ES datasheet(2/91 Pages) NXP

2 / 91 page

NXP Semiconductors

PF5023

Power management integrated circuit (PMIC) for high performance applications

PF5023

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 15 April 2020

2 / 91

3 Simplified application diagram

aaa--032234

V1P5D

VIN

V1P5A

SW1FB

SW1LX

SW2FB

SW2LX

SW3FB

SW3LX

PGOOD

VDDIO

PGOODx

VDDIO

INTB

AGND

VDDIO

SDA

TBBEN

VDDIO

XFAILB

V1P5A

RESETBMCU

VDDIO

PF5023

SW1IN

VPRE

SW2IN

SW3IN

VDDOTP

VDDIO

PWRON

STANDBY

ENx

WDI

SCL

VDDIO

SYNC

Figure 1. Simplified application diagram

4 Ordering information

Table 1. Ordering information

Package

Type number [1]

Name

Description

Version

MPF5023AMBA0ES [2]

MPF5023AMMA0ES [3]

Plastic thermal enhanced very thin quad flat pack; no leads, wettable

flank, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body

Temperature grade: 125 ℃

MPF5023AVNA0ES [4]

HVQFN40

Plastic thermal enhanced very thin quad flat pack; no leads, wettable

flank, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body

Temperature grade: 105 ℃

SOT618-14

[1]

To order parts in tape and reel, add the R2 suffix to the part number.

[2]

Automotive part, Safety grade: ASIL B

[3]

Automotive part, Safety grade: QM

[4]

Industrial part

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