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P87LPC779FDH Datasheet(PDF) 71 Page - NXP Semiconductors |
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P87LPC779FDH Datasheet(HTML) 71 Page - NXP Semiconductors |
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71 / 74 page ![]() Philips Semiconductors P87LPC779 CMOS single-chip 8-bit microcontroller Product data Rev. 02 — 03 May 2004 71 of 74 9397 750 13213 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 14. Package outline Fig 31. SOT360-1. UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M b p D Z e 0.25 110 20 11 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 |
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