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HC705MC4GRS/D Datasheet(PDF) 165 Page - NXP Semiconductors

Part # HC705MC4GRS/D
Description  General Release Specification
PDF  180 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

HC705MC4GRS/D Datasheet(HTML) 165 Page - NXP Semiconductors

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Electrical Specifications
Functional Operating Range
General Release Specification
Electrical Specifications
14.4 Functional Operating Range
14.5 Thermal Characteristics
Table 14-2. Operating Range
Characteristic
Symbol
Value
Unit
Operating Temperature Range
MC68HC705MC4P, DW, S (Standard)
MC68HC705MC4CP, CDW, CS (Extended)
MC68HC705MC4VP, VDW, VS (Automotive)
MC68HC705MC4MP, MDW, MS(Automotive)
TA
TL to TH
0 to 70
–40 to 85
–40 to 105
–40 to 125
°C
Operating Voltage Range
VDD
5.0
± 10%
V
Table 14-3. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal Resistance
Plastic (28 Pin)
SOIC (28 Pin)
θ
JA
60
60
°C/W
I/O Pin Power Dissipation
PI/O
User Determined
W
Power Dissipation(1)
PD
PD = (IDD x VDD) + PI/O =
K/(TJ + 273 °C)
W
Constant(2)
K
PD x(TA + 273 °C)
+ PD
2 x
θ
JA
W/
°C
Average Junction Temperature
TJ
TA + (PD x θJA)
°C
Maximum Junction Temperature
TJM
125
°C
NOTES:
1. Power dissipation is a function of temperature.
2. K is a constant unique to the device. K can be determined for a known TA and
measured PD. With this value of K, PD and TJ can be determined for any value of TA.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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