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HC705MC4GRS/D Datasheet(PDF) 175 Page - NXP Semiconductors |
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HC705MC4GRS/D Datasheet(HTML) 175 Page - NXP Semiconductors |
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175 / 180 page  General Release Specification Mechanical Specifications General Release Specification — MC68HC705MC4 Section 15. Mechanical Specifications 15.1 Contents 15.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175 15.3 Plastic Dual In-Line Package (Case 710) . . . . . . . . . . . . . . . .176 15.4 Small Outline Integrated Circuit (Case 751F) . . . . . . . . . . . . .176 15.2 Introduction The MC68HC705MC4 is available in both a 28-pin plastic dual in-line package (PDIP) and a small outline integrated circuit (SOIC) package. The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following: • Local Freescale Sales Office • Worldwide Web http://www.freescale.com Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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