LMK05028RGCT.B datasheet(8/94 Pages) TI2

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5.4 Thermal Information

THERMAL METRIC(1) (2) (3)

LMK05028

UNIT

RGC (VQFN)

64 PINS

RθJA

Junction-to-ambient thermal resistance

20.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

6.3

°C/W

RθJB

Junction-to-board thermal resistance

4.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.3

°C/W

ψJT

Junction-to-top characterization parameter

0.1

°C/W

ψJB

Junction-to-board characterization parameter

4.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The thermal information is based on a 10-layer 200 mm x 250 mm board with 49 thermal vias (7 x 7 pattern, 0.3 mm holes).

(3)

ΨJB can allow the system designer to measure the board temperature (TPCB) with a fine-gauge thermocouple and back-calculate the

device junction temperature, TJ = TPCB + (ΨJB x Power). Measurement of ΨJB is defined by JESD51-6.

5.5 Electrical Characteristics

Over Recommended Operating Conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Power Supply Characteristics

IDD_IN0,

IDD_IN1,

IDD_IN3

Core Supply Current

(VDD_INx)

3.5

IDD_IN2

Core Supply Current

(VDD_IN2)

IDD_XO

Core Supply Current

(VDD_XO)

IDD_TCXO

Core Supply Current

(VDD_TCXO)

Configuration A(2)

Configuration B(3)

IDD_PLL1

Core Supply Current

(VDD_PLL1)

Configuration A(2)

160

188

Configuration B(3)

185

217

IDD_PLL2

Core Supply Current

(VDD_PLL2)

Configuration A(2)

138

160

Configuration B(3)

160

187

IDD_DIG

Core Supply Current

(VDD_DIG)

Configuration A(2)

Configuration B(3)

IDDO_x

Output Supply Current(10)

(VDDO_x = 3.3 V ± 5%)

AC-LVDS

AC-CML

AC-LVPECL

HCSL

IDDO_x

Output Supply Current(11)

(VDDO_x = 3.3 V ± 5%)

AC-LVDS (x2)

AC-CML (x2)

AC-LVPECL (x2)

HCSL (x2)

IDDPDN

Total Supply Current

(all VDD and VDDO pins, 3.3 V)

Device powered-down (PDN pin held

low)

LMK05028

SNAS724B – FEBRUARY 2018 – REVISED FEBRUARY 2025

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