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AS4DDR264M72PBG1-3/XT Datasheet(PDF) 25 Page - Micross Components

Part # AS4DDR264M72PBG1-3/XT
Description  Proprietary Enchanced Die Stacked iPEM
PDF  28 Pages
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Manufacturer  MICROSS [Micross Components]
Direct Link  http://www.micross.com
Logo MICROSS - Micross Components

AS4DDR264M72PBG1-3/XT Datasheet(HTML) 25 Page - Micross Components

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iPEM
4.8 Gb SDRAM-DDR2
AS4DDR264M72PBG1
AS4DDR264M72PBG1
Rev. 3.1 01/10
25
Micross Components reserves the right to change products or specifications without notice.
AC OPERATING SPECIFICATIONS (CONTINUED)
-3
-38
-5
667Mbps
533Mbps
400Mbps
Symbol
MIN
MAX
MIN
MAX
MIN
MAX
Units
Address and Control input puslse width for each input
tIPW
0.6
0.6
0.6
tCK
Address and Control input setup time
tISJEDEC
200
250
350
ps
Address and Control input hold time
tIHJEDEC
275
375
475
ps
CAS\ to CAS\ command delay
tCCD
222
tCK
ACTIVE to ACTIVE command (same bank)
tRC
55
55
55
ns
ACTIVE bank a to ACTIVE bank b Command
tRRD
10
10
10
ns
ACTIVE to READ or WRITE delay
tRCD
15
15
15
ns
4-Bank activate period
tFAW
50
50
50
ns
ACTIVE to PRECHARGE
tRAS
40
70000
1
40
70000
1
40
70000
1
ns
Internal READ to PRECHARGE command delay
tRTP
7.5
7.5
7.5
ns
WRITE recovery time
tWR
15
15
15
ns
Auto PRECHARGE WRITE recovery+PRECHARGE time
tDAL
tWR + tRP
tWR + tRP
tWR + tRP
ns
Internal WRITE to READ command delay
tWTR
7.5
7.5
10
ns
PRECHARGE command period
tRP
15
15
15
ns
PRECHARGE ALL command period
tRPA
tRP+tCL
tRP+tCL
tRP+tCL
ns
LOAD MODE, command Cycle time
tMRD
222
tCK
CKE LOW to CK, CK\ uncertainty
tDELAY
ns
REFRESH to ACTIVE or REFRESH to REFRESH
command Interval
Average periodic REFRESH interval [Industrial temp]
tREFIIT
7.8
7.8
7.8
us
Average periodic REFRESH interval [Enhanced temp]
tREFIET
5.9
5.9
5.9
us
Average periodic REFRESH interval [Military temp]
tREFIXT
3.9
3.9
3.9
us
Exit SELF REFRESH to non READ command
Exit SELF REFRESH to READ command
Exit SELF REFRESH timing reference
ODT turn-on delay
tAOND
2
2
2
2
2
2
tCK
ODT turn-on delay
tAOND
tAC(min)
tAC(max)+
700
tAC(min)
tAC(max)+
1000
tAC(min)
tAC(max)+
1000
ps
ODT turn-off delay
tAOPD
2.5
2.5
2.5
2.5
2.5
2.5
tCK
ODT turn-off delay
tAOF
tAC(min)
tAC(max)+
600
tAC(min)
tAC(max)+
600
tAC(min)
tAC(max)+
600
ps
ODT turn-on (power-down mode)
tAONPD
tAC(min) +
2000
2 x tCK +
tAC(max)+
1000
tAC(min) +
2000
2 x tCK +
tAC(max)+
1000
tAC(min) +
2000
2 x tCK +
tAC(max)+
1000
ps
ODT turn-off (power-down mode)
tAOFPD
tAC(min) +
2000
2.5 x tCK +
tAC(max)+
1000
tAC(min) +
2000
2.5 x tCK +
tAC(max)+
1000
tAC(min) +
2000
2.5 x tCK +
tAC(max)+
1000
ps
ODT to power-down entry latency
tANPD
3
3
3
tCK
ODT power-down exit latency
tAXPD
8
8
8
tCK
ODT enable from MRS command
tMOD
12
12
12
ns
Exit active POWER-DOWN to READ command, MR[12]=0
tXARD
2
2
2
tCK
Exit active POWER-DOWN to READ command, MR[12]=1
tSARDS
7 - AL
6 - AL
6 - AL
tCK
Exit PRECHARGE POWER-DOWN to any non READ
tXP
2
2
2
tCK
CKE Min. HIGH/LOW time
tCLE
3
3
3
tCK
Note 1: Max value reduced to 10,000ns at 125
oC
70000
1
tIS + tCL + tIH
tRFC
tXSNR
tXSRD
tISXR
tRFC(min)+1
0
tRFC(min)+1
0
tIS + tCL + tIH
tIS + tCL + tIH
127
70000
1
127
70000
1
127
ps
tIS
200
tIS
tIS
Parameter
200
ns
tCK
ns
200
tRFC(min)+1
0



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