VSC8541XMV-05 datasheet(96/101 Pages) MICROCHIP

Part #	VSC8541XMV-05

Description	Single Port Gigabit Ethernet Copper PHY with GMII/RGMII/MII/RMII Interfaces

PDF	101 Pages

Scroll/Zoom	100%

Manufacturer	MICROCHIP [Microchip Technology]

Direct Link	http://www.microchip.com

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96 / 101 page

Package Information

VMDS-10513 VSC8541-02 Datasheet Revision 4.1

Figure 36 •

Package Drawing

7.2

Thermal Specifications

Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These

documents are available on the JEDEC website at www.jedec.org. The thermal specifications are

modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p

Terminal Tip

0.80

0.00

5.10

0.30

0.15

0.85

0.02

0.203 Ref

8.00 BSC

5.20

8.00 BSC

5.20

1.00 Ref

0.40 BSC

0.40

0.20

0.90

0.05

5.30

0.50

0.25

Dimensions and Tolerances

Reference Minimum Nominal

Maximum

Pin 1

corner

4×

0.10 C

0.07 M Z X Y

0.05 M Z

Top View

Bottom View

Side View

Notes

All dimensions and tolerances are in millimeters (mm).

Dimension b applies to the metalliz ed terminal and is

measured between 0.15 mm and 0.30 mm from the

terminal tip.

Maximum package warpage is 0.08 mm.

Detail A

0.08 Z

Pin 1

corner

0.20 R

Detail A

VSC8541XMV-05 Datasheet(PDF) 96 Page - Microchip Technology

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