| Electronic Components Datasheet Search |
|
S25FL256SDPNFVC Datasheet(PDF) 44 Page - Cypress Semiconductor |
|
|
|||||||||||||||||||||||||||||
S25FL256SDPNFVC Datasheet(HTML) 44 Page - Cypress Semiconductor |
|
44 / 149 page ![]() Document Number: 001-98283 Rev. *M Page 43 of 148 S25FL128S/S25FL256S 6.4.2 FAC024 24-Ball BGA Package Physical Diagram FAC024 — 24-Ball BGA (6 x 8 mm) Package 6.4.3 Special Handling Instructions for FBGA Packages Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. SHEET OF REV SPEC NO. THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION. CYPRESS TITLE SCALE : Company Confidential PACKAGE CODE(S) DRAWN BY APPROVED BY DATE DATE METALLIZED MARK INDENTATION OR OTHER MEANS. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" = eD/2 AND WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" OR "SE" = 0. POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. "SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. e REPRESENTS THE SOLDER BALL GRID PITCH. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 8. 9. 7 ALL DIMENSIONS ARE IN MILLIMETERS. PARALLEL TO DATUM C. 5. 6 4. 3. 2. 1. NOTES: SD b eD eE ME N 0.35 0.50 BSC 1.00 BSC 1.00 BSC 0.40 24 4 0.45 D1 MD E1 E D A A1 0.25 - 5.00 BSC 3.00 BSC 6 6.00 BSC 8.00 BSC - - 1.20 - SE 0.50 BSC DIMENSIONS SYMBOL MIN. NOM. MAX. "SE" = eE/2. FAC024 KOTA BESY 18-JUL-16 18-JUL-16 ** 002-15535 PACKAGE OUTLINE, 24 BALL FBGA 12 TO FIT 8.0X6.0X1.2 MM FAC024 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |