MCPF1412M06 datasheet(60/63 Pages) MICROCHIP

60 / 63 page

MCPF1412M06

Package Information

Data Sheet

DS60001885C - 60

RECOMMENDED LAND PATTERN

Land Pattern

Dimension Limits

Units

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.725 BSC

MIN

MAX

4.35

Contact Pad Length (X14)

Contact Pad Width (X14)

0.85

0.50

NOM

SILK SCREEN

Contact Pad Spacing

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, pleease refer to current industry standard IPC-7093.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

22-Lead Land Grid Array 5.8x4.9x1.7

1mm (8FW) [LGA] - System in Package [SIP]

Microchip Technology Drawing C04-02660 Rev B

2.35x1.65

1.15x1.10

2.35x1.10

1.15x2.50

3.75x0.95

1.300

2.550

2.225

1.275

0.775

2.050

1.15x0.60

0.95x0.60

0.700

0.850

MCPF1412M06 Datasheet(PDF) 60 Page - Microchip Technology

MCPF1412M06 Datasheet(HTML) 60 Page - Microchip Technology

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