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STM8S105C4B3C Datasheet(PDF) 111 Page - STMicroelectronics |
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STM8S105C4B3C Datasheet(HTML) 111 Page - STMicroelectronics |
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111 / 127 page ![]() 32-lead VFQFPN package mechanical data 11.2.4 Figure 50: 32-lead very thin fine pitch quad flat no-lead package (5 x 5) Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin # 1 ID R = 0.30 8 E L L D2 1 b E2 42_ME Bottom view Note: 1. The exposed pad must be soldered to the PCB. It is recommended to connect it to VSS. Table 55: 32-lead very thin fine pitch quad flat no-lead package mechanical data inches (1) mm Dim. Max Typ Min Max Typ Min 0.0394 0.0354 0.0315 1.00 0.90 0.80 A 0.0020 0.0008 0.05 0.02 0 A1 0.0079 0.20 A3 0.0118 0.0098 0.0071 0.30 0.25 0.18 b 0.2028 0.1969 0.1909 5.15 5.00 4.85 D 111/127 DocID14771 Rev 9 Package characteristics STM8S105xx |
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