Analog Integrated Circuit Device Data

6

Freescale Semiconductor

908E624

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RATINGS

Package Operating Ambient Temperature (4)

MM908E624ACDWB and MM908E624ACEW

MM908E624AYEW

-40 to 85

-40 to 125

°C

Operating Junction Temperature (2)(4)

MM908E624ACDWB and MM908E624ACEW

MM908E624AYEW

-40 to 125

-40 to 125

°C

Storage Temperature

-40 to 150

°C

Peak Package Reflow Temperature During Reflow(3)(5)

Note 5

°C

Notes

2.

The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because

of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.

3.

Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

4.

package thermal resistance, and available heat sinking.

5.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent

damage to the device.

Rating

Symbol

Value

Unit