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DA7282-00FVC Datasheet(PDF) 72 Page - Renesas Technology Corp |
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DA7282-00FVC Datasheet(HTML) 72 Page - Renesas Technology Corp |
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72 / 75 page  LRA/ERM Ultra-Low Power Haptic Driver with Multiple Input Triggers and Integrated Waveform Memory R15DS0041EE0330 Rev.3.30 June 16, 2026 CFR0011-120-00 Page 72 12. Layout Guidelines For optimal layout, place the 100 nF capacitor as close to VDD and GND_1 pins as possible. It is also advisable to use a solid ground plane under the device. The QFN can be routed out on a single layer. It is recommended to connect GND_1 and GND_2 to a local ground plane on the top layer with a low-impedance via connection to the main ground plane, see Figure 44. nIRQ VIA VIA VIA VIA VIA TO VDD LAYER VIA TO GND LAYER SOLID GND CONNECTION ON TOP LAYER 100 nF Capacitor 0201 (0603) SCL SDA GPI_1 GPI_2 VDDIO/ EN GPI_0/ PWM OUTN GND_2 VDD OUTP GND_1 Figure 43. WLCSP example PCB layout VIA VIA VIAS TO GND LAYER SOLID GND CONNECTION ON TOP LAYER 100 nF Capacitor 0603 (1608) VIA VIA nIRQ SCL SDA VDDIO/EN OUTN GND_1 GND_2 OUTP VDD GPI_2 GPI_1 GPI_0/PWM Figure 44. QFN example PCB layout |
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