W25Q32FVZPIP datasheet(5/99 Pages) WINBOND

Part #	W25Q32FVZPIP

Description	3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

PDF	99 Pages

Scroll/Zoom	100%

Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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5 / 99 page

W25Q32FV

Publication Release Date: Sept 16,, 2013

- 4 -

Revision H

10.5

16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 91

10.6

8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 92

10.7

24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 93

10.8

24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 94

11.

ORDERING INFORMATION .......................................................................................................... 95

11.1

Valid Part Numbers and Top Side Marking ........................................................................ 96

12.

REVISION HISTORY...................................................................................................................... 97

W25Q32FVZPIP Datasheet(PDF) 5 Page - Winbond