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W25Q32FVZPIP Datasheet(PDF) 63 Page - Winbond

Part # W25Q32FVZPIP
Description  3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
PDF  99 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q32FVZPIP Datasheet(HTML) 63 Page - Winbond

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W25Q32FV
Publication Release Date: Sept 16,, 2013
- 62 -
Revision H
8.2.25
Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 39. The Device ID values for the W25Q32FV are listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (90h)
High Impedance
8
9
10
28
29
30
31
Address (000000h)
23
22
21
3
2
1
0
Device ID
*
/CS
CLK
DI
(IO
0)
DO
(IO
1)
32
33
34
35
36
37
38
39
Manufacturer ID (EFh)
40
41
42
44
45
46
7
6
5
4
3
2
1
0
*
43
31
0
Mode 0
Mode 3
= MSB
*
Figure 39. Read Manufacturer / Device ID Instruction (SPI Mode)



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