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W25Q32FVZPIP Datasheet(PDF) 90 Page - Winbond |
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W25Q32FVZPIP Datasheet(HTML) 90 Page - Winbond |
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90 / 99 page ![]() W25Q32FV - 89 - 10.3 8-Pad WSON 6x5-mm (Package Code ZP) Symbol Millimeters Inches Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.35 0.40 0.48 0.014 0.016 0.019 C --- 0.20 REF --- --- 0.008 REF --- D 5.90 6.00 6.10 0.232 0.236 0.240 D2 3.35 3.40 3.45 0.132 0.134 0.136 E 4.90 5.00 5.10 0.193 0.197 0.201 E2 4.25 4.30 4.35 0.167 0.169 0.171 e 1.27 BSC 0.050 BSC L 0.55 0.60 0.65 0.022 0.024 0.026 y 0.00 --- 0.075 0.000 --- 0.003 Note: 1.The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad. |
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