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W25Q32FVZPIP Datasheet(PDF) 67 Page - Winbond

Part # W25Q32FVZPIP
Description  3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
PDF  99 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q32FVZPIP Datasheet(HTML) 67 Page - Winbond

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W25Q32FV
Publication Release Date: Sept 16,, 2013
- 66 -
Revision H
8.2.29
Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q32FV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in Figure 43a & 43b. For memory type
and capacity values refer to Manufacturer and Device Identification table.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (9Fh)
High Impedance
8
9
10
12
13
14
15
Capacity ID7-0
/CS
CLK
DI
(IO
0)
DO
(IO
1)
16
17
18
19
20
21
22
23
Manufacturer ID (EFh)
24
25
26
28
29
30
7
6
5
4
3
2
1
0
*
27
15
Mode 0
Mode 3
11
7
6
5
4
3
2
1
0
*
Memory Type ID15-8
= MSB
*
Figure 43a. Read JEDEC ID Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3
0
1
IO
0
IO
1
IO
2
IO
3
9Fh
2
3
4
5
12
8
13
9
14
10
15
11
EFh
6
4
0
5
1
6
2
7
3
ID15-8
ID7-0
IOs switch from
Input to Output
Instruction
Mode 0
Mode 3
Figure 43b. Read JEDEC ID Instruction (QPI Mode)



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