W25Q32FVZPIP datasheet(25/99 Pages) WINBOND

25 / 99 page

W25Q32FV

Publication Release Date: Sept 16,, 2013

- 24 -

Revision H

INSTRUCTIONS

The Standard/Dual/Quad SPI instruction set of the W25Q32FV consists of 45 basic instructions that are

fully controlled through the SPI bus (see Instruction Set Table1-2). Instructions are initiated with the falling

edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code.

Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.

The QPI instruction set of the W25Q32FV consists of 32 basic instructions that are fully controlled

through the SPI bus (see Instruction Set Table 3). Instructions are initiated with the falling edge of Chip

Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code. Data on all

four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All QPI

instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of data

with every two serial clocks (CLK).

Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data

bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the

rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5

through 57. All read instructions can be completed after any clocked bit. However, all instructions that

Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been

clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent

writes. Additionally, while the memory is being programmed or erased, or when the Status Register is

being written, all instructions except for Read Status Register will be ignored until the program or erase

cycle has completed.

8.1

Device ID and Instruction Set Tables

8.1.1

Manufacturer and Device Identification

MANUFACTURER ID

(MF7 - MF0)

Winbond Serial Flash

EFh

Device ID

(ID7 - ID0)

(ID15 - ID0)

Instruction

ABh, 90h, 92h, 94h

9Fh

W25Q32FV (SPI Mode)

15h

4016h

W25Q32FV (QPI Mode)

15h

6016h

W25Q32FVZPIP Datasheet(PDF) 25 Page - Winbond

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