W25Q32FVZPIP datasheet(83/99 Pages) WINBOND

83 / 99 page

W25Q32FV

Publication Release Date: Sept 16,, 2013

- 82 -

Revision H

9.4

DC Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

SPEC

UNIT

MIN

TYP

MAX

Input Capacitance

CIN(1)

VIN = 0V

Output Capacitance

Cout(1)

VOUT = 0V

Input Leakage

ILI

±2

µA

I/O Leakage

ILO

±2

µA

Standby Current

ICC1

/CS = VCC,

VIN = GND or VCC

µA

Power-down Current

ICC2

/CS = VCC,

VIN = GND or VCC

µA

Current Read Data /

Dual /Quad 50MHz

ICC3(2)

C = 0.1 VCC / 0.9 VCC

DO = Open

Current Read Data /

Dual /Quad 80MHz

ICC3(2)

C = 0.1 VCC / 0.9 VCC

DO = Open

Current Read Data /

Dual Output Read/Quad

Output Read 104MHz

ICC3(2)

C = 0.1 VCC / 0.9 VCC

DO = Open

Current Write Status

ICC4

/CS = VCC

Current Page Program

ICC5

/CS = VCC

Current Sector/Block

Erase

ICC6

/CS = VCC

Current Chip Erase

ICC7

/CS = VCC

Input Low Voltage

VIL

–0.5

VCC x 0.3

Input High Voltage

VIH

VCC x 0.7

VCC + 0.4

Output Low Voltage

VOL

IOL = 100 µA

0.2

Output High Voltage

VOH

IOH = –100 µA

VCC – 0.2

Notes:

1. Tested on sample basis and specified through design and characterization data. TA = 25°C, VCC = 3. 0V, 25% driver strength

2. Checker Board Pattern.

W25Q32FVZPIP Datasheet(PDF) 83 Page - Winbond

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