ADT7476A

www.onsemi.com

69

PACKAGE DIMENSIONS

QSOP24 NB

CASE 492B

ISSUE A

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E

M

0.25

C

A1

A

C

DETAIL A

DETAIL A

h x 45

_

DIM

MAX

MIN

MILLIMETERS

A

1.35

1.75

b

0.20

0.30

L

0.40

1.27

e

0.635 BSC

h

0.22

0.50

C

0.19

0.25

A1

0.10

0.25

M

0

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION.

4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH,

PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT

INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT

EXCEED 0.15 PER SIDE. D AND E1 ARE

DETERMINED AT DATUM H.

5. DATUMS A AND B ARE DETERMINED AT DATUM H.

__

b

L

D

D

24X

SEATING

PLANE

0.10 C

E1

A

A-B D

0.20 C

e

112

24

13

24X

C

M

D

8.65 BSC

E

6.00 BSC

E1

3.90 BSC

L2

0.25 BSC

D

0.25 C D

B

0.20 C D

2X

2X

2X 12 TIPS

0.10 C

H

L2

GAUGE

PLANE

C

6.40

24X

0.42

24X

1.12

0.635

DIMENSIONS: MILLIMETERS

24

PITCH

13

112

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