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AMD-K6-2E/233AMZ Datasheet(PDF) 304 Page - Advanced Micro Devices |
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AMD-K6-2E/233AMZ Datasheet(HTML) 304 Page - Advanced Micro Devices |
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304 / 332 page  286 Thermal Design Chapter 16 AMD-K6™-2E Processor Data Sheet 22529B/0—January 2000 Preliminary Information Figure 98 shows the thermal model of a processor with a passive thermal solution. The ambient temperature (TA) is guaranteed as long as TC is not violated. The case-to-ambient temperature (TCA) can be calculated from the following equation: TCA = PMAX • qCA = PMAX • ( qIF + qSA) Where: PMAX = Maximum Power Consumption qCA = Case-to-Ambient Thermal Resistance qIF = Interface Material Thermal Resistance qSA = Sink-to-Ambient Thermal Resistance Figure 98. Thermal Model Figure 9 9 illustrates the case-to-ambie nt te mpera ture (TCA=TC –TA) in relation to the power consumption (X-axis) and the thermal resistance (Y-axis). If the power consumption and case temperature are known, the thermal resistance ( qCA) requirement can be calculated for a given ambient temperature (TA) value. Temperature Thermal q SA q CA qIF (°C/W) (Ambient) Case Sink TCA Resistance |
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