AMD-K6-2ESLASH233AMZ datasheet(306/332 Pages) AMD

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288

Thermal Design

Chapter 16

AMD-K6™-2E Processor Data Sheet

22529B/0—January 2000

Preliminary Information

Thermal grease is recommended as interface material because

it provides the lowest thermal resistance (

@ 0.20°C/W). The

required thermal resistance (

qSA) of the heatsink in this

example is calculated as follows:

qSA = qCA – qIF = 1.25 – 0.20 = 1.05(°C/W)

Heat Dissipation Path

Figure 100 illustrates the heat dissipation path of the processor.

Due to the lower thermal resistance between the processor die

junction and case, most of the heat generated by the processor

is transferred from the top surface of the case. The small

amount of heat generated from the bottom side of the processor

where the processor socket blocks the convection can be safely

ignored.

Figure 100. Processor Heat Dissipation Path

16.2

Measuring Case Temperature

The processor case temperature is measured to ensure that the

therm a l s o l u ti on meets the pr oces sor ’s oper a t i o nal

specification. This temperature should be measured on the top

center of the package, where most of the heat is dissipated.

Figure 101 on page 289 shows the correct location for measuring

the case temperature. The tip of the thermocouple should be

secured to the package surface with a small amount of

thermally conductive epoxy. A second location along the

thermocouple should also be secured to avoid any movement

during testing.

If a heatsink is installed while measuring, the thermocouple

must be installed into the heatsink via a small hole drilled

through the heatsink base (e.g., 1/16 of an inch). Secure the

thermocouple to the base of the heatsink by filling the small

hole with thermal epoxy, allowing the tip of the thermocouple

to protrude the epoxy and touch the top of the processor case.

Thin Lid

Case temperature

Ambient Temperature

AMD-K6-2E/233AMZ Datasheet(PDF) 306 Page - Advanced Micro Devices

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