AMD-K6-2ESLASH233AMZ datasheet(307/332 Pages) AMD

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Chapter 16

Thermal Design

289

22529B/0—January 2000

AMD-K6™-2E Processor Data Sheet

Preliminary Information

Figure 101. Measuring Case Temperature

16.3

Sample Heatsink Measured Data

The example measured data (provided in tables 69 through 72

and figures 105 through 108) shows case-to-ambient thermal

resistance and maximum ambient temperature for both

socketed and soldered processors using three passive heatsink

samples with different height profiles (see Table 68) and

different levels of airflow in the system. This data is based on

the following specification assumptions:

TC = 85°C = TC(MAX) for 1.9-V low-power K6-2E processors

Pd = 10 W

qCA = qSA + qIF

TA(MAX) = TC(MAX) – (qCA ·Pd)

TA(MAX) = 85 - (qSA + qIF)·Pd

Note: AMD does not guarantee the example measured heatsink

data provided in tables 69 through 72 and figures 105

through 108. This data is supplied for informational

purposes only to facilitate the selection of an appropriate

thermal solution.

Example Heatsinks

Table 68 describes the three heatsinks tested. Figure 102,

Figure 103, and Figure 104 show the actual heatsinks.

Thermocouple

Thermally Conductive Epoxy

Table 68. Passive Heatsink Samples

Identifier

Size X (mm)

Size Y (mm)

Size Z Height (mm)

A52

B52

C50

AMD-K6-2E/233AMZ Datasheet(PDF) 307 Page - Advanced Micro Devices