AMD-K6-2ESLASH233AMZ datasheet(311/332 Pages) AMD

311 / 332 page

Chapter 16

Thermal Design

293

22529B/0—January 2000

AMD-K6™-2E Processor Data Sheet

Preliminary Information

Soldered Installation:

Case-to-Ambient

Thermal Resistance

Table 71 and Figure 107 show the measured values for the case-

to-ambient thermal resistance (

qCA in °C/watt) at different

levels of airflow in the system for the low-power embedded

AMD-K6-2E processors with a maximum thermal power

diss ipation of 10.0 watts (OPN s: AMD-K6-2E/266AMZ,

AM D-K6 -2 E / 300 AMZ , an d AMD - K6 -2 E/ 3 3 3 A M Z) an d a

maximum case temperature rating of 85°C, in the 321-pin

Ceramic Pin Grid Array package (CPGA) when soldered into a

printed circuit board.

Figure 107. Measured Thermal Resistance v. Airflow (Soldered 321-Pin CPGA Package)

Table 71. Soldered CPGA Package: Measured Thermal Resistance (°C/W)

qJC and qCA

Heatsink Type

qJC (°C/W)

qCA (°C/W) v. Airflow (m/s)

0.0 m/s

1.0 m/s

2.0 m/s

3.0 m/s

4.0 m/s

No Heatsink

1.0

7.0

5.2

4.2

3.3

2.7

A (15 mm)

1.0

5.2

3.4

2.4

1.9

1.7

B (20 mm)

1.0

4.9

2.9

2.0

1.5

1.3

C (30 mm)

1.0

4.3

2.5

1.6

1.4

1.2

012

Airflow Rate (m/s)

1RQH

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